ODU, a worldwide leader in designing and manufacturing high performance connector solutions and cable assemblies, is announcing its high speed connector solutions as part of the ODU AMC® portfolio to the European market.
ODU AMC® is an advanced miniature connector solution series designed for harsh environment applications. It is used extensively in soldier communications and future soldier systems that require significant weight and space reduction such as: tactical radios, portable computers, navigation and surveillance systems, night vision, digital scopes, UAVs and airborne vehicles.
The ODU AMC® connector series include ODU AMC® High-Density, ODU AMC® Break-Away and ODU AMC® Push-Pull. These advanced high speed connector solutions offer high performance data transmission, high bandwith transmission, high reliability and easy handling. The product portfolio of the ODU AMC® High-Density includes USB 3.0, USB 2.0 and an HDMI option. In addition to the USB 2.0 version and Ethernet designs with transfer rates of 100 Mbit to 10 Gbit, ODU offers also a connector that combines USB 2.0 and Ethernet transfer.
The connection systems in the ODU AMC® series are smaller and lighter than the MIL housings with RJ45 inserts. They are extremely robust, versatile and easy to handle.
The main characteristics of this product series are: 5,000 mating cycles durability, Push-Pull or Break-Away function for maximum safety, watertight protection IP 68 and IP 69, optimised colour coding, highly reliable shielding properties (360°), operating temperature range of -51° C (-60° F) to +125° C (+257° F), salt spray resistance, high-speed data transfer capability, numerous high density signal configurations and tailored versions for power (up to 15A) and data transfer (USB 3.0 with 5A power) in a very compact package.
ODU high speed connector solutions include also a series of Push-Pull circular connectors and modular rectangular connectors that have a large applicability in industries such as industrial, measurement and testing and medical.